From concept to prototype, we accelerate microelectronics development across six essential phases: Chip Design, Wafer Fab, Wafer Testing, Die/Chip Process, System Level Package, and Packaging Testing.

A dedicated hardware hub supporting full research and development processes of micro/nano sensors and associated devices, including sensor chip/devices fabrication and pilot runs, packaging, and testing.

Location: Building 9W, Science Park 

Features a Class 10,000 cleanroom and communal backend packaging tools to support 3D System-in-Package (SiP) prototyping and commercialisation.

Location: Building 6W, Science Park

With flexible design, dedicated cleanroom*, and special chemical handling facilities*, MEC and its expansion are established to support the development and pilot production of new generation micro-electronics products.

* For MEC only

Location: Yuen Long InnoPark

Partner with Arrow Electronics, it provides advanced infrastructure, technical expertise, and global supply chain resources to accelerate chip prototyping, hardware integration, and mass production.

Location: Building 18E, Science Park

A one-stop hub to support prototyping, low-volume assembly, and pilot production for smart manufacturing and tech enterprises.

Location: Advanced Manufacturing Centre (AMC), Tseung Kwan O InnoPark

Equipped with advanced capabilities in smart electronics, optical equipment, sensor fabrication, robo-electronics, and smart power devices for smart city applications, it enables SMEs to produce high-quality prototypes and run flexible pilot production.

Location: Advanced Manufacturing Centre (AMC), Tseung Kwan O InnoPark