HKSTP and Arrow Electronics have joined forces to bring the power of microelectronics to life. Our world-class Hardware Lab is designed to accelerate market-ready microelectronic innovations to change the world for the better. Supported by 15+ industry experts and 5+ global partners, we offer extensive insights and business networks to inspire and elevate your unique product development, taking your business to new heights.

At Hong Kong's largest innovation ecosystem, we build the most collaborative community supporting startups to navigate the complex landscape of product development and market testing. With our guidance and resources, your microelectronics innovations will thrive on a global scale, making a positive impact on the world today and tomorrow.

Together, we spark the next wave of innovation, from chips to products.

About Hardware Lab

HKSTP Arrow Hardware Lab is aimed at nurturing high-potential startups and innovators in a wider range of cutting-edge chip prototyping projects and bringing together a talent pool that will facilitate product development from the board to system level. The first-of-its-kind Hardware Lab in Science Park will feature expanded infrastructure and facilities, and bring in more global leading industry partners and developers to boost Hong Kong to become a hub of hardware start-ups that are specialized in building core technologies.

Participating companies at Hardware Lab will benefit from the vast global network, technical expertise, and supply chain capabilities and be empowered to solve hardware integration problems, remove time-to-market barriers, and accelerate chip-to-prototype-to-production journeys.

Service Scope

  • Analogy and Digital Electronics
  • Wireless Communication
  • Power Electronics
  • Signal Processing
  • Sensors
  • Artificial Intelligent
  • Embedded Systems
  • Renewable Energy
  • Robotics and Automation & etc
  • Conceptual consultation
  • Micro-E feasibility study
  • Core solution recommendation
  • System Design
  • Evaluation testing (Lab)
  • ME consideration
  • Development kit sourcing
  • Circuit design
  • PCB Layout
  • Firmware implementation
  • ME design
Prototype Manufacturing
  • Materials sourcing
  • PCB fabrication
  • 3D printing Circuit testing
  • Firmware programming
  • HW/SW debug
  • Functional testing
  • RF tuning/ matching