The Heterogeneous Integration Laboratory (HI Lab) serves as a dynamic hub that both transcends the traditional concept of a laboratory and actively shapes the future of microelectronics by fostering a thriving Microelectronics (Micro-E) ecosystem. By providing collaborative platform for heterogeneous systems and advanced packaging, we've designed our facilities, including a Class 10,000 cleanroom space, to accommodate a broad range of R&D activities in microelectronics. This allows for the pilot run and prototyping of microelectronics devices and systems, accelerating startups and innovators from ideation to commercialisation.
The HI Lab's collaborative environment unites a diverse range of microelectronics stakeholders, including technology companies, R&D centres, universities, and innovators. This synergy accelerates both the development and co-development of products and expedites commercialisation processes, ultimately contributing to the reindustrialisation of Hong Kong's microelectronics sector.
In addition, the Hong Kong Science and Technology Parks Corporation (HKSTP) provides a suite of communal equipment and tools for backend packaging and 3D System-in-Package (SIP) technologies, along with technical support and consultation services by partners.
Join us and play a pivotal role in the reindustrialisation of Hong Kong's microelectronics sector.
G/F, Building 6W, 6 Science Park West Avenue
9am to 6pm, Monday to Friday, except Hong Kong Public Holidays