Institute of Microelectronics of Chinese Academy of Sciences Organises International Conference at Hong Kong Science Park to Cover the Latest Development of Electronic Packaging and Manufacturing Technologies

(Hong Kong, 16 August 2019) – Hong Kong Science and Technology Parks Corporation (HKSTP) and Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) hosted the International Conference on Electronic Packaging Technology (ICEPT) 2019 at Hong Kong Science Park. Marking its 20th anniversary, the international conference was held outside of China for the first time. 

The only conference of its kind focusing on electronic packaging, the event brought together experts, leading industry players, academics and Park companies to discuss the latest trends and development of packaging and manufacturing technologies for ICs, optoelectronics, passives, and Microelectromechanical Systems (MEMS).

This emerging sector is creating many new opportunities for technology talent. As part of HKSTP’s value-added services, an onsite job-matching service was provided at the conference, to address the recruitment needs of Park companies. 

This conference marks the first event for HKSTP’s Electronics Month. Other upcoming events include Conference on Sensors and IoT Standard for Smart City cum Inauguration of IEEE P2668 IoT Maturity Index, and the launch of HKSTP Micro-Electronics Node under the iDM2 acceleration programme.