23 Aug 2023
"HKSTP x HKUST x Infineon Microelectronics Ecosystem Conference" Accelerates Hong Kong's Mission to Lead Global Microelectronics Innovation
Key Takeaways
- Hong Kong’s large-scale microelectronics conference advances development as a world-leading microelectronics innovation and talent hub
- HKSTP x HKUST x Infineon partnership sees over 40 technology showcases to demonstrate microelectronics growing innovation strength and potential
- Hong Kong at heart of GBA forms a vital hub in the global microelectronics value chain
(Hong Kong, 23 August 2023) - Hong Kong Science and Technology Parks Corporation (HKSTP), the Hong Kong University of Science and Technology (HKUST) and Infineon Technologies Hong Kong Limited (Infineon), successfully held and co-organised the "HKSTP x HKUST x Infineon Microelectronics Ecosystem Conference" at Hong Kong Science Park. The city’s large-scale microelectronics conference gathered the “industry, academic, and research sectors” to expand horizons and propel Hong Kong as a world-leading microelectronics innovation and talent hub.
Over 40 technology showcases (refer to Appendix) from HKSTP Park companies, HKUST spin-offs, and Infineon partners provided a show of Hong Kong’s diverse strength in microelectronics innovation and applications. Key innovation focus areas included smart mobility, healthcare and new energy, while global microelectronics leaders and experts shared insights across three conference tracks of talent, research and industry, to inspire young up and coming professionals.
The conference also marks the first-year anniversary of the strategic co-incubation programme between HKSTP and Infineon, which provides theme-based training, lab resources, and tech expertise to the up-and-coming microelectronics ventures. Today, almost 200 HKSTP partner companies, universities and InnoHK Centres have benefited from the training sessions offered by the programme under different microelectronics themes. Six real-life application projects are now being developed in collaboration with our Park companies.
The HKSAR Government has declared a mission to build up the microelectronics industry as a key pillar of the city’s I&T ecosystem, as set out in the "Hong Kong I&T Development Blueprint". This rides on predictions from McKinsey that the global semiconductor industry will surpass USD 1 trillion by 2030, with the Asia-Pacific commanding 62% market share. Hong Kong’s potential is clear as one the world’s largest importers and exporters of semiconductors and located at the heart of the GBA, making it a crucial hub in the global semiconductor supply and value chain.
Professor Dong Sun, JP, Secretary for Innovation, Technology and Industry, HKSAR Government, said: “Today, we are celebrating the building of a Microelectronics Ecosystem in Hong Kong. We strongly believe that the further growth and development of this ecosystem can catalyse economic growth, drive technological advancement, foster collaboration, nurture talent, diversify industries, and enhance global recognition. It has the potential to position Hong Kong as a prominent player in the field of microelectronics and contribute to the long-term development as an innovation-driven economy.”
Mr Albert Wong, CEO of HKSTP, said: "Hong Kong has a prime opportunity to shine on the world stage with our microelectronics innovation strength and unique location at the heart of the GBA. Together with our partners HKUST and Infineon, the Microelectronics Ecosystem Conference will be a launchpad to unleash our full potential and forge a world-class microelectronics sector as a key pillar in the mission to be an international I&T hub.”
Hong Kong's microelectronics community has already achieved remarkable research breakthroughs spanning diverse areas, including chip design, advanced packaging, and silicon photonics. HKSTP has seen surging growth, more than doubling the number of chip and device companies from 40 in 2020 to over 90 today. Today, a total of 249 microelectronics related companies have emerged from the HKSTP ecosystem alone.
To support this growth, HKSTP has built an extensive network of microelectronics hardware infrastructure and capability to provide a complete end-to-end support system driving “concept to creation” for emerging tech ventures. The suite of HKTSP facilities include: the Sensor Packaging and Integration Laboratory (Sensor Lab), Heterogenous Integration Lab (HI Lab), Microelectronics Centre (MEC), the Hardware Lab and ProShop. These cover the complete spectrum of design and prototyping to pilot production of chips, devices and related systems and products.
Appendix
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