(Hong Kong, 30 October 2026) — Hong Kong Science and Technology Parks Corporation (HKSTP) recently participated in the inaugural Future Industries Zone (FIZ) at the Hong Kong Electronics Fair (Autumn Edition) as a supporting organisation. With a focus on Future Microelectronics, the HKSTP Pavilion brought together five world-renowned microelectronics enterprises that have established their footprint within HKSTP’s ecosystem, namely the Hong Kong Microelectronics Research and Development Institute (MRDI), Laservall, CTGL (Computime Group Limited), Intron Technology and MassPhoton. Together, they showcased cutting-edge innovations spanning semiconductor research, precision manufacturing, smart electronics and optical communications, demonstrating their complementary capabilities across different parts of the value chain.
Highlighted exhibitors and technologies are as below:
- CTGL showcased a smart energy ecosystem powered by a Vehicle-to-Grid (V2G) EV charger, Matter-enabled smart devices, and Home Energy Management Systems (HEMS), demonstrating how electric vehicles, connected homes, and energy assets can work together to optimise energy use, support grid resilience and accelerate the transition to a more sustainable future. Its V2G EV charger won the Gold Prize at Electronics Industries Awards presented by the Hong Kong Electronic Industries Association (HKEIA).
- Intron Technology showcased its High-Integration Chip-on-Board (COB) 3D Perception Module designed for robotics, automated rovers, and humanoid embodied intelligence, delivering real-time depth mapping beyond conventional sensing limits; and Advanced Embedded Component Packaging (ECP) Power Module offering superior thermal performance and high-power density for next-generation EV powertrain systems.
- Laservall builds intelligent engineering platforms that connect precision laser processing, automation, vision inspection and AI, helping manufacturers in high-value industries achieve micron-level precision, consistent quality and higher efficiency. It showcased its XMLS (neXt-generation Micro Laser Soldering) solution for precision joining, micro-laser jet soldering, and an integrated platform with laser optics, Automated Optical Inspection (AOI) and AI process intelligence in one system.
Enabling the Next Wave of Industrial Advancement
Beyond showcasing innovations, HKSTP also curated two panel discussions highlighting the growing role of microelectronics as a key driver of industrial advancement, exploring the journey from research to industrial application, manufacturing and market expansion. The first session invited HKSTP’s ecosystem partners from the microelectronics industry and the academic sector to discuss how microelectronics research can be translated into industrial impact; while the second session featured four park company representatives sharing their insights of advanced manufacturing, smart products and global expansion.
To provide comprehensive support throughout the journey from 0 to 1 and 1 to N, HKSTP has built an integrated microelectronics ecosystem which is home to more than 300 microelectronics companies, bringing together specialised R&D and pilot manufacturing facilities and a diverse network of industry partners and researchers. Through this collaborative ecosystem, HKSTP helps transform promising microelectronics innovations into high-value applications, empowering the next wave of industrial development.
HKSTP Startups Advance to CES 2027
Another highlight of the Future Industries Zone is the CES Asia Unveiled Hong Kong Startup Pitch Competition, where HKSTP incubated startups, ExoTechHK Limited and EzyGreenPak were named the co-winners and both received the complimentary exhibit space in Eureka Park at Consumer Electronics Show (CES) 2027 in the US. ExoTechHK was recognised for developing wearable robotic exoskeletons that support the body during physical tasks and help users to reduce fatigue; EzyGreenPak stood out for its plant-based nonwoven fabric that dissolves in hot water with no microplastics. By winning a place at one the most impactful tech events in the world, the two startups will be able to showcase their innovations on the global stage for boarder business opportunities.
