Date
11 Dec 2025 - 13 Dec 2025
Venue
HKCEC, Hall 1A-B, HKSTP Pavilion (Hall 1B, E-14)
HKSTP Pavilion at Construction Innovation Expo 2025
Discover the future at the HKSTP Pavilion for Construction Innovation Expo 2025. Under the theme "AI+ Building A Smarter Tomorrow," we present Hong Kong's premier ConTech ecosystem. Experience two immersive scenarios powered by seven pioneering AI-driven ConTech companies, demonstrating a revolution in construction safety and productivity.
Key highlights include RIC Tech Co., Limited's debut of Asia’s first mobile 3D printing concrete robot, alongside FJ Dynamics International Limited’s Lidar scanning technology that generates real-time colorised point clouds. The pavilion also features five other park companies—all early-stage tech startups making their CIExpo debut. Witness the pioneering AI technologies that are building a smarter tomorrow.
Participating Hong Kong Science Park Companies (listed below in alphabetic order)
Company Name