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DeepSonix Limited54df83a8-74d1-ef11-8ee9-000d3aa08849_CompanyLogo_24072026
Electronics

DeepSonix Limited

Company

DeepSonix Limited, a deep-tech startup from The University of Hong Kong, is revolutionising quality control for next-generation electronics. Our patented AI-empowered ultrafast ultrasound technology finds microscopic flaws in complex chips in seconds, a process that once took hours. This enables 100% inspection, saving manufacturers millions and bringing more reliable, cutting-edge devices to you faster.

Description

Ultrafast Ultrasound Microscopy Non Destructive Evaluation Solution for Three-Dimensional Integrated Circuits.

Our Beliefs

At DeepSonix Limited, we believe manufacturing precision should not compromise speed or depth. By pioneering AI-empowered ultrafast ultrasound technology, we break the inspection trilemma for next-generation 3DICs. We are committed to empowering semiconductor manufacturers with non-destructive, 100% quality control, bringing safer, more reliable cutting-edge electronics to the world faster.

Product

DeepSonix LimitedProductImg154df83a8-74d1-ef11-8ee9-000d3aa08849_ProductImage1_24072026
DeepSonix LimitedProductImg254df83a8-74d1-ef11-8ee9-000d3aa08849_ProductImage2_24072026
ultraNDE is an advanced, non-destructive packaging inspection system powered by patented, AI-empowered ultrafast ultrasound technology. Specifically engineered for next-generation 3DIC manufacturing, it effectively breaks the industry's critical "inspection trilemma." Utilising proprietary array transducers and advanced beamforming algorithms, ultraNDE detects microscopic internal flaws and packaging defects within complex chips in seconds rather than hours, delivering reliable, 100% inline quality control for high-throughput production lines.

Technology

Core Technology
DeepSonix Limited provides a non-destructive inspection solution powered by patented, AI-empowered ultrafast ultrasound technology. Featuring proprietary array transducers and advanced beamforming algorithms, the system resolves the "inspection trilemma" by balancing speed, resolution, and penetration depth. AI models detect microscopic internal flaws in seconds without altering components.

Services
We offer 100% inline quality control and non-destructive testing tailored for advanced 3DIC packaging, deploying industrial demonstration lines with global manufacturing leaders.

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