Hong Kong Science and Technology Parks Corporation Designated As “Hong Kong National High-Tech Industrialisation Partner Base for Integrated Circuits” by Ministry of Science and Technology of the People’s Republic of China

(Hong Kong, 4 December 2014) - Hong Kong Science and Technology Parks Corporation (“HKSTP”) held a plaque unveiling ceremony today to signify its new status as the “Hong Kong National High-Tech Industrialisation Partner Base for Integrated Circuits”, designated by Ministry of Science and Technology of the People’s Republic of China (“MOST”). HKSTP will continue its endeavour to facilitate Mainland and Hong Kong’s IC innovation and development, catalysing business opportunities for IC companies in Asia and globally. 

The plaque unveiling ceremony was held at Hong Kong Science Park. Officiating guests included Dr. Cao Jianlin, Vice Minister of MOST; Prof. Li Lu, Director-General, Department of  Educational, Scientific and Technological Affairs, Liaison Office of the Central People’s Government in the HKSAR; Mr. Ma Linying, Deputy Director-General, Department of International Cooperation (Office of Hong Kong, Macao and Taiwan Affairs) of MOST; Miss Janet Wong, JP, Commissioner for Innovation and Technology, The Government of the HKSAR; and HKSTP’s Chairperson The Honourable Mrs. Fanny Law, GBS, JP and Chief Executive Officer Mr. Allen Ma. 

MOST’s recognition is an endorsement to Hong Kong’s innovation and technology capabilities. Over the past three years, HKSTP has received MOST’s recognition as the “Hong Kong National High-Tech Industrialisation (Partner) Base for Green Technology” and “Hong Kong National Modern Services Industrialisation (Partner) Base”. Through stronger connections and closer collaboration with research institutions and partners in Mainland, HKSTP is reinforcing Hong Kong’s position as Asia’s innovation and technology hub.

Strengthens collaboration and promotes industry development

Integrated Circuits is not only the building block for development of electronics, telecommunications and information technology, but also a strategic industry for China. Since 2000, MOST has approved the setup of nine “National IC Design Industrialisation Base” in cities such as Beijing, Shanghai and Shenzhen, who have demonstrated specific R&D strength and advantages in relations to education, industrialisation and talent development. These National IC Design Bases have become the driving forces of the IC industry through a series of initiatives, from provision of software and hardware platforms, to nurturing of start-ups and talents; and from exchange of information and new production development, to international collaboration and enterprise financing. 

In supporting the local IC industry, HKSTP has not only been providing professional services to IC companies, but also capitalising on Hong Kong’s world-class university R&D capabilities, and the city’s strong connection with the IC markets in Europe, US and Japan for R&D and production. Since 2003, HKSTP has signed agreements with the nine National IC Design Industrialisation Bases and collaborated with them under the “9+1” model (nine Bases and the HKSTP). Under this “9+1” model, HKSTP supports the nine Bases with high-end IC testing, product analysis, intellectual property services, as well as specialised engineering services. This model will be further strengthened as HKSTP has obtained the “Hong Kong National High-Tech Industrialisation Partner Base for Integrated Circuits” status, paving the way for a more diverse and comprehensive collaboration to accelerate the globalisation of technology and products developed by Mainland and Hong Kong companies. 

Dr. Cao Jianlin, Vice Minister of MOST said: “The IC industry plays an instrumental role in the information technology industry – fundamentally and strategically supporting economic and social development, as well as national security. In recent years, the IC industry in Mainland has grown rapidly, thanks to increasing market demand and favourable policy support, and solid partnership with Hong Kong has been established through the “9+1” model. This model fully leverages the advantages of HKSTP and the nine National IC Design Bases, and fosters the development of Hong Kong and Mainland’s IC industry. We are looking forward to further strengthening the working relationship between Hong Kong and Mainland, driving the sustainable development of the value chain, and realising the leapfrog growth of the IC industry.” 

Mrs. Fanny Law, Chairperson of HKSTP, said, “Electronics engineering, including IC, has been one of HKSTP’s focused clusters. We’ve been supporting the nine National IC Design Industrialisation Bases and other IC companies through the provision of a wide range of advanced supporting services. As of November 2014, we have completed 441 projects for Mainland companies. We have also been awarded the first Hong Kong-Macau-Taiwan project, in which HKSTP will be working closely with the Tianjin National Industrialisation Base on a three-and-a-half-year ‘Cloud Based IC Testing and Design Platform for Development and Application’ project. Enabled by cloud technologies, the project will give Tianjin companies access to HKSTP’s design automation computing resources and testing services through the Internet in an on-demand, easy-to-scale and pay-per-use manner. This will accelerate the breakthrough of some core technologies, and drive the development of the IC industry in Tianjin and in China as a whole.”

Mrs. Law added, “MOST’s recognition of HKSTP as a ‘Hong Kong National High-Tech  Industrialisation Partner Base for Integrated Circuits’ is an endorsement to HKSTP’s effort in promoting innovation and technology development, as well as the corporation’s endeavour in Mainland-Hong Kong collaboration. Hong Kong has world-class facilities and technologies for IC testing and analysis. It also has world-renowned academic institutions and professionals, an intellectual property system and resources that meet international standards, and a free flow of capital and information. With all these advantages, we expect to share our resources with Mainland partners, as well as reinforcing the strategic partnership with the National IC Design Bases and high-tech R&D counterparts in the country.” 

Advanced R&D facilities to drive industry activities

HKSTP has been driving IC innovation and development for both Mainland and Hong Kong markets. Throughout these years, HKSTP has invested tremendously on advanced laboratory facilities and diverse support services, which include the IC Design Centre, IP Servicing Centre, Probe and Test Development Centre, Reliability Laboratory and IC Failure Analysis Laboratory. To meet market needs, HKSTP set up the 3D Systems Level Packaging Lab with advanced IC packaging R&D and low volume pilot production services in 2013, which is first of its kind in the South China. HKSTP will continue to introduce advanced equipment in enabling enterprises to enjoy a one-stop solution for the entire IC design process in Hong Kong.

Upon being designated as “Hong Kong National High-Tech Industrialisation Partner Base for Integrated Circuits”, HKSTP hopes to further strengthen the resources sharing and professional specialisation between Mainland and Hong Kong in order to boost the competitive advantages and drive new opportunities for the IC industry. Some of these synergy examples include nurturing IC design companies through collaboration in the management of laboratory facilities; leveraging HKSTP’s expertise in intellectual property (IP) management and virtual IP platform to drive cooperation between Mainland and overseas companies; fully utilise Hong Kong’s advantages in enterprise financing to attract Mainland and overseas start-up companies to set up R&D facilities in Mainland and Hong Kong, and consider IPO in Hong Kong; and working together to drive the development and supply chain integration of 3D ICs.