HKSTP and Horizon Robotics Sign Memorandum of Understanding to Establish a ‘Technology Innovation R&D Center’ and Expand Its Team to Around 100 Personnel

(Hong Kong, 1 December 2023) – Hong Kong Science and Technology Parks Corporation (HKSTP) and Horizon Robotics today signed a Memorandum of Understanding (MoU) to establish a ‘Technology Innovation R&D Center’ at the Hong Kong Science Park. Horizon Robotics plans a cumulative investment of approximately HK$3 billion by the end of 2028 and aims to expand its team to around 100 R&D personnel. This collaboration is intended to boost the development of Hong Kong's microelectronics and intelligent driving ecosystem.

Jointly steered by the ITIB and the OASES, the collaboration between HKSTP and Horizon Robotics is committed to propel the development of Hong Kong's microelectronics and intelligent vehicle industry. The MoU was signed by Ir Dr HL Yiu, Chief Corporate Development Officer of HKSTP, and Ms Annie Tao, Co-founder and Chief Operation Officer of Horizon Robotics. The signing was witnessed by Professor Sun Dong, Secretary for Innovation, Technology, and Industry; Mr Philip Yung, Director-General of the Office for Attracting Strategic Enterprises; Ms Lillian Cheong, Under Secretary for Innovation, Technology, and Industry; Dr Sunny Chai, Chairman of HKSTP; and Dr Kai Yu, Founder and Chief Executive Officer of Horizon Robotics.

Professor Sun Dong, Secretary for Innovation, Technology and Industry, said: “We have seen several new energy and intelligent vehicle enterprises setting up operations in Hong Kong in recent months. This injects tremendous dynamism into our relevant ecosystems and propels vibrant development. By establishing an international R&D centre and expanding its global operations at Hong Kong Science Park, Horizon Robotics makes use of Hong Kong as a platform to achieve its globalization and get its product to further align with the international standard for expanding to overseas market, which is a proof of Hong Kong's advantage of enjoying strong support of the Motherland and being closely connected to the world. The Chief Executive announced in the 2023 Policy Address to establish the New Industrialisation Development Office. Together with the Research, Academic and Industry Sectors One-plus Scheme, New Industrialisation Acceleration Scheme, Hong Kong Microelectronics Research and Development Institute and the AI Supercomputing Centre, these initiatives will become vital engines for driving the development of new industrialisation in Hong Kong and building the city as an international I&T centre.”

Dr Sunny Chai, Chairman of HKSTP, said, “The landing of Horizon Robotics at Science Park marks a significant milestone in the development of Hong Kong’s microelectronics industry, actively contributing to the long-term diversification of Hong Kong’s economy. HKSTP will work hand-in-hand with Horizon Robotics to drive the growth of Hong Kong's microelectronics industry and intelligent driving ecosystem. At the same time, we aspire to collectively nurture microelectronics talents, establishing Hong Kong as an international I&T centre.”

Dr Kai Yu, Founder and Chief Executive Officer of Horizon Robotics, said, "Horizon Robotics is delighted to collaborate with HKSTP in establishing the Technology Innovation R&D Center at the Hong Kong Science Park. The Hong Kong Science Park can provide Horizon Robotics with an ideal environment for business and R&D, complemented by comprehensive support. Horizon Robotics looks forward to utilising the Technology Innovation R&D Center to expedite the R&D and deployment of automated driving computing solutions, thereby empowering the automated driving industry in Hong Kong and the Greater Bay Area, and fostering the prosperity and development of Hong Kong's smart vehicle ecosystem."

The “Hong Kong Innovation and Technology Development Blueprint”, released last year, emphasised that the country fully supports Hong Kong to become the international I&T centre, encompassing sectors such as the microelectronics industry. The 2023 Policy Address further announced the establishment of the “Hong Kong Microelectronics Research and Development Institute”. This institute aims to drive collaboration among universities, R&D centres and corporations, as well as provide a more conducive environment for the advancement of the microelectronics industry.

As a leading provider of energy-efficient computing solutions for advanced driver assistance systems (ADAS) and automated driving (AD) for consumer vehicles, Horizon Robotics is committed to enhancing next-generation driving experiences by integrating hardware and software, including low-power hardware computing solutions and open software development tools. By closely collaborating with a community of partners, Horizon Robotics offers products and services that enable an open ecosystem to accelerate the transformation of smart electric vehicles. Horizon Robotics has independently developed the BPU (Brain Processing Unit) – a computing architecture for automated driving – and launched the Journey series automotive-grade computing solutions, with shipments exceeding 4 million units to date. The company has collaborated with over 30 major domestic and overseas automobile companies and more than 100 industry partners. Dr. Kai Yu, Founder and Chief Executive Officer of Horizon Robotics, is a world renowned expert in machine learning and an important promoter of the application of deep learning technology in mainland China. The company has more than 1,500 top talents across areas such as software, hardware, tool chains, and computing architecture and holds nearly 2,000 patents.

HKSTP remains steadfast in its commitment to advancing Hong Kong’s new industrialisation mission and establishing a world-leading microelectronics ecosystem. The microelectronics ecosystem at HKSTP has nearly 250 companies. Currently, five of Hong Kong’s universities rank among the top 100 globally, with over 100 university researchers engaged in microelectronics research. HKSTP has set up a comprehensive microelectronics hardware infrastructure. These facilities are equipped to support the end-to-end process of design, prototyping and the pilot production of relevant equipment and systems, as well as products.