Press Room

HKSTP Partners United Microelectronics Centre (UMEC) to Organise the First AI Chips Summit Promoting AI Hardware Development


06 Dec 2019


Albert Wong, Chief Executive Officer of HKSTP, said in the AI Chips Summit that HKSTP will provide infrastructural facilities for advanced manufacturing industries to diversify Hong Kong's economy.

Dr. Walden Rhines, CEO Emeritus, Mentor, a Siemens Business, shared how a new IC (Integrated Circuit) design approach accelerates AI applications.

Global and regional technology elites, together with key industry players, academics and Park company delegates, gathered at the summit to explore the latest AI chip development.

Global and regional technology elites, together with key industry players, academics and Park company delegates, gathered at the summit to explore the latest AI chip development.

Global and regional technology elites, together with key industry players, academics and Park company delegates, gathered at the summit to explore the latest AI chip development.

Hong Kong, 5 December 2019 – Hong Kong Science and Technology Parks Corporation (HKSTP) and United Microelectronics Centre (UMEC) today jointly organised the AI Chips Summit for the  first time to promote the development of an Artificial Intelligence (AI) hardware ecosystem. The Summit assembled world-renowned technology experts, industry players, academics and representatives from Park companies under one roof to discuss best-of-breed, machine learning-based design methodologies and supporting tools for the development of AI chips and accelerators.

Following the debut programme of HKSTP’s Thought-leadership Series in July earlier this year, the AI & Computer Vision Summit 2019, this AI Chips Summit remained as a main platform for connecting stakeholders who are at the forefront of AI, facilitating knowledge sharing through inspiring keynotes and panel discussions.

Currently, Science Park is home to more than 80 semiconductor-related companies. HKSTP strives to provide them with all-round support to foster the development of AI and microelectronics ecosystems. HKSTP’s iDM2 Micro-Electronics Node, launched in August this year, is Hong Kong's first FPGA-based electronics accelerator aimed at catalysing the next phase of industry growth. The HKAI Lab, jointly established by HKSTP, Alibaba and Sensetime, has enabled startups to commercialise AI inventions. With Artificial Intelligence & Robotics (AIR) serving as one of the HKSTP major focuses, AI Plug@HKSTP ready for launch next year will provide AIR communities with one-stop technical services and infrastructure support. All of these initiatives highlight HKSTP’s ongoing efforts to power the development of AI and innovative technology.

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