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HKSTP Partners Global Accelerator Plug and Play in Calling Startups for EPiC 2023 Elevator Pitch Competition in Hong Kong

Extended 20 January deadline set for global competition with huge scale-up opportunities in Asia


13 Jan 2023


(Hong Kong, 13 January 2023) – Hong Kong Science and Technology Parks Corporation (HKSTP) has partnered with world-leading innovation platform, Plug and Play, to call on ambitious startups and entrepreneurs around the world to join the seventh Elevator Pitch Competition 2023 (EPiC 2023), one of the biggest pitch events in Hong Kong. The final entry deadline for the Competition has also been extended to 20 January 2023.

This offers local and global startups the chance to join the combined HKSTP and Plug and Play eco-systems to launch their potential innovations onto the global stage. Interested parties on two technology tracks (FinTech and PropTech) only need to submit a 2-min video introduction to make a potentially life-changing decision. 50 shortlisted semi-finalists will have the golden opportunity to be considered by HKSTP Venture Fund for direct investment of up to US$5 million as well as market expansion support in Asia and beyond, plus the chance to win a cash prize of US$60,000 if crowned champion.

As the world’s leading accelerator, Plug and Play will leverage its global network to organise international competitions in Asia, Europe and Northern America throughout February to bring in overseas startups to the April final in Hong Kong.

Hong Kong provides the ideal platform to expand into the vast Asian market, being a gateway to both Mainland China and Asia. Startups joining EPiC 2023 can fully leverage the largest I&T ecosystem in Hong Kong and HKSTP’s direct connections to over 1,000 investors and more than 300 corporate partners.

Albert Wong, CEO of HKSTP, said: “This year, our flagship event EPiC is set to be the biggest and best-ever as we partner with world-renowned Plug and Play, elevating the investment platform to a truly global level. This collaboration cements HKSTP and Hong Kong as a unique global launchpad to rapidly scale up innovators on their growth journey, while achieving our mission to propel success and advance Hong Kong's I&T development.”

Saeed Amidi, CEO of Plug and Play, said: “Partnering with HKSTP on EPiC is a major step forward in our mission to harness the huge Asia opportunity to build the world’s leading innovation platform. We are partnering with changemakers like HKSTP to build a unique innovation ecosystem by connecting the brightest minds with world-leading corporations, VC firms, universities, and government agencies across multiple industries.’’

EPiC 2023 will take place at the iconic sky100 venue atop Hong Kong’s tallest building, International Commerce Centre, to create a genuine elevator pitch experience for startups.


Who can apply:

  • Tech startups that are less than 10 years old
  • Ideas should focus on one of the TWO technology tracks: FinTech and PropTech

Applications will close on 20 January 2023 at 23:59 (Hong Kong time).

Please visit the website (https://epic.hkstp.org/) for more information on EPiC 2023.

(Picture 1) HKSTP CEO, Albert Wong, joins Plug and Play CEO, Saeed Amidi, to promote HKSTP’s EPiC 2023, calling all startups in the world to come to Hong Kong for a scale-up opportunity of a lifetime.

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