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iPV is a start-up company focusing on the development and application of copper nanoparticle conductive pastes. They can be used for various printed electronics applications which include interconnects on silicon solar cells, touch panels, and biosensors. iPV, formed with researchers from HKUST, has developed a novel oxidation-proof coating that protects copper from oxidation during processing. These copper nanoparticles are then formulated into inks and pastes using a wide variety of solvents and additives for specific applications.
iPV has developed two types of conductive copper pastes:
Firing type copper paste
The firing type copper paste contains copper particles of various sizes. The sintering temperature is reduced to 600°C which is lower than that of conventional silver paste (750°C). A perfect non-porous copper film with high conductivity and without cracks can be formed after sintering. The firing type copper paste is suitable for use in polycrystalline silicon and monocrystalline silicon solar cells. The improved paste formula is also applicable for other ceramic substrates.
Laser sintering type copper paste
iPV has developed a unique formulation of a laser sintering type copper paste. With only copper nanoparticles, the improved copper paste formula can be laser-sintered at ambient conditions. The paste can be used for a variety of substrates, including glass, ceramic, and plastic materials such as polyethylene terephthalate and polyimide.