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Doctech HK Limited is a semiconductor company adopting a newly developed nano-twin copper material especially for the applications of three-dimensional integrated circuit (3DIC) packing. Doctech focuses on the development and commercialisation of nt-Cu as a promising nanomaterial in redistribution layers (RDLs), Cu interconnects and micro-pillar for consumer electronics. Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability and to provide solutions and platform technologies. The nt-Cu material features a promising Cu-Cu bonding technology, which can provide a lower interfacial resistance, making it an ideal technology for the future hybrid Cu-Cu bonding of monolithic three-dimensional (M3D) ICs packing.
Doctech has invented a novel method to fabricate nano-twin copper (nt-Cu) and nano-grain (nc-Cu) copper electroplating materials. In electroplating, controlling the additive formula and content to obtain a suitable grain structure is the key for RDLs/TSV/Interconnect/Pillars technologies, which are ideally suited for high-density requirements. Different layouts are enabled for fan-out wafer level packages to meet next-generation line/space requirements down to 2 µm. The nt-Cu and nc-Cu chemistries are formulated to enhance the reliability of fine-line RDL and improve via-filling performance. The technology requires the Cu to have optimum uniformity, high purity and reliability, superior via-filling and reduced manufacturing costs. A hybrid structure is constructed for future hybrid bonding. The two kinds of copper materials, nt-Cu and nc-Cu, can achieve direct hybrid copper-copper bonding technology at low-temperature, to promote bonding to form a stable and void-free interface and to solve the key issues in M3DIC packing for electromigration (EM) and thermomigration (TM).