Sensor Packaging and Integration Lab



The Sensor Packaging and Integration Laboratory (Sensor Lab) is a dedicated hardware hub that supports the full research and development cycle of micro/nano sensors and associated devices, including sensor chip/devices fabrication and pilot runs, packaging, and testing.

Two locations comprising 10,000 sq. ft. of cleanroom space (class 100, class 1000 and class 10000) are offered to users for conducting research and product development. Apart from fully furnished cleanroom facilities, HKSTP and our partners also provide common wafer processing tools (including deposition, patterning, etching, packaging and characterisation), technical support and consultation services.

We also welcome R&D partners to formulate government-funded technology projects that would utilize the laboratory service as part of the pilot production.

 

Paper for Micro/ Nano sensors for healthcare and smart city

This paper provides a quick overview of sensor development at Science Park, followed by snapshots of the observations and insights of the speakers in 1st International Symposium on Micro/Nano Sensors for Healthcare and Smart City at December 10, 2018. 

Micro/Nano Sensors for Healthcare and Smart City (2018)

Shared Lab Facilities Highlights

Wafer-level Process

Pre/Wet Processes

Wet Bench

  • Photoresist & chemical stripper tank 
  • KOH, RCA tank
  • HF related solution or buffer tank
  • Spin Dryer
  • Heater

Etching

XeF2 Silicon Etcher (memsstar Alpha)

XeF2 Silicon Etcher (memsstar Alpha)

  • Wafer size: 6” single wafer or specimens
  • Gases available: XeF2, N2
  • Materials: Silicon

Packaging

Wafer Bonder (AML-AWB008)

Wafer Bonder (AML-AWB008)

  • Wafer size: 6”
  • Substrate materials: Silicon
  • Pressure: 1x10-6 mbar to 2 bar
  • Temperature: up to 560oC

Die/Chip-level process

Die/Chip Preparation

Wafer Dicing System (ADT7100)

  • Wafer size: 8”
  • Single spindle: 2”
  • Covered materials: IC wafers, Glass, MEMS Chips

Die/Chip Packaging

Die Bonder (Datacon 2200 evo)

  • X/Y placement accuracy X / Y: + 10um @ 3 Sigma
  • Die size: 0.17mm - 50mm (epoxy) & 0.8mm - 50mm (FlipChip)
  • Epoxy thickness: setting range 0.1mm - 5mm

Die/Chip Packaging

Wire Bonder (ASM Eagle Xpress)

  • Thermosonic bonding
  • Wire size: 0.6mil ~ 2.0mils
  • Max wire length: 8mm

Testing & Characterisation

Surface Profiler (Veeco Dektak 8)

Surface Profiler (Veeco Dektak 8)

  • Wafer size: max. 8”
  • Vertical Resolution: 1 Å max. (@6.55μm range)
  • Max. Scan Length: 50mm (2in.) standard
  • Stylus Force: 1 to 15mg

Atomic Force Microscopy, AFM (Veeco D3100)

Atomic Force Microscopy, AFM (Veeco D3100)

  • Wafer size: max. 8”
  • XY scan range: 90 μm x 90 μm
  • Z scan range: 6 μm
  • Radius of probe tip size: 20-60nm

Enquiry

  • Sensor Lab User/ Partner Application
  • Sensor Lab Visit
  • Operation Training
  • Charging Scheme

Ms. Candy Cheng

Tel: +852 2629 6981

Email: candy.cheng@hkstp.org

Mr. Adam Wu

Tel: +852 2628 6732

Email: adam.wu@hkstp.org

Email: sensor@hkstp.org

Contact Us

For general enquiry, or questions about HKSTP’s services and support, please enter your email address and query here.