The IC Failure Analysis Laboratory (ICFAL) provides laboratory services with advanced test equipment to support the product analysis for semiconductor devices and electronic products.


Experienced engineers provide complete IC failure analysis flow including:
  • Verify Failure Mode
  • Electrical Testing
  • External Package Inspection
  • Internal Package Inspection
  • De-capsulation
  • Defect Location
  • Layer De-processing
  • Optical Microscopy
  • Scanning Electron Microscopy
  • Circuit Editing
  • Structural Analysis

Laboratory Services - Equipment List

 

Verify Failure Mode

Curve Tracer (Tektronix 370B)

Curve Tracer
(Tektronix 370B)

Verify Failure Mode

Parametric Analyzer (HP 4155A)

Parametric Analyzer
(HP 4155A)

Electrical Testing

ESD (HBM/MM) & Latch-up Tester (Thermo KeyTek ZapMaster MK 2)

ESD (HBM/MM) & Latch-up Tester
(Thermo Fisher Scientific MK.2 ESD and Latch-Up Test System)

External and Internal Package Inspection 

Stereo Microscope
(Leica S6D)

Stereo Microscope
(Leica S6D)

 

External and Internal Package Inspection 

Scanning Acoustic Microscope (PVA TePla WIN SAM-Vario III)

Scanning Acoustic Microscope
(PVA TePla WIN SAM-Vario III)

External and Internal Package Inspection 

nordsondagexd7600ntdiamond150x150

2D and 3D (CT-scan) X-Ray Inspection System
(Nordson Dage XD7600NT Diamond FP)

 

De-capsulation

Laser Decapsulation System (Nisene)

Laser Decapsulation System
(Nisene)

De-capsulation

Decapsulated Samples

Decapsulated Samples

De-capsulation

Decap on specific area

Decap on specific area

De-capsulation

Copper Wire decap

Copper Wire decap

De-capsulation

On-board Decap

On-board Decap

De-capsulation

Package remove–expose backside of Chip

Package remove
– expose backside of Chip

 

Defect Locate

Emission Microscope, (EMM)I with Laser Scanning Microscope
(LSM /OBIRCH) (DCG Systems TriVision)

Emission Microscope, (EMMI) with Laser Scanning Microscope (LSM /OBIRCH)
(Thermo Fisher Scientific TriVision) 

 

Defect Locate

Fault found with EMMI

Fault found with EMMI

Defect Locate

Thermal Emission (DCG System,s ELITE)

Thermal Emission
(Thermo Fisher Scientific ELITE)

Defect Locate

Fault found with ELITE

Fault found with ELITE

Defect Locate

Laser Cutter (EzLaze Laser Cutting System)

Laser Cutter
(EzLaze Laser Cutting System)

Defect Locate

Manual Probe Station (Karl Suss PM-8)

Manual Probe Station
(FormFactor PM-8)

Layer De-processing

Reactive Ion Etching (RIE) systems (Oxford Instruments,, Plasmalab 80+)

Reactive Ion Etching (RIE) systems
(Oxford Instruments, Plasmalab 80+)

 

Layer De-processing

Layer deprocessing

Layer deprocessing

Optical Microscopy, SEM

High Magnification Microscope (Leica DM8000M)

High Magnification Microscope
(Leica DM8000M)

Optical Microscopy, SEM

Image under Hign Power Microscope

Image under Hign Power Microscope

Optical Microscopy, SEM

Counting Metal layers

Counting Metal layers

Optical Microscopy, SEM

Field Emission Scanning Electron Microscope
(ZEISS GeminiSEM 300 )

 

Optical Microscopy, SEM

Defect under SEM

Defect under SEM

Optical Microscopy, SEM

Defect under SEM

Defect under SEM

Circuit Editing

Focused Ion Beam (DCG Systems OptiFIB -IV) 

Focused Ion Beam
(Thermo Fisher Scientific OptiFIB -IV)

Structural Analysis

Cross-section on PCB

Cross-section on PCB

Structural Analysis

Cross-section on camera lens

Cross-section on camera lens

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