The IC Failure Analysis Laboratory (ICFAL) provides laboratory services with advanced test equipment to support the product analysis for semiconductor devices and electronic products.


Experienced engineers provide complete IC failure analysis flow including:
  • Verify Failure Mode
  • Electrical Testing
  • External Package Inspection
  • Internal Package Inspection
  • De-capsulation
  • Defect Localization
  • Layer De-processing
  • Optical Microscopy
  • Scanning Electron Microscopy
  • Circuit Editing
  • Structural Analysis

 

Laboratory Services - Equipment List

 

Verify Failure Mode

Curve Tracer (Tektronix 370B)

Curve Tracer
(Tektronix 370B)

 

Parametric Analyzer (HP 4155A)

Parametric Analyzer
(HP 4155A)

Electrical Testing

ESD (HBM/MM) & Latch-up Tester (Thermo KeyTek ZapMaster MK 2)

ESD (HBM/MM) & Latch-up Tester
(Thermo Fisher Scientific MK.2 ESD and Latch-Up Test System)

 

External and Internal Package Inspection

 

Stereo Microscope
(Leica S6D)

Stereo Microscope
(Leica S6D)

 

 

Scanning Acoustic Microscope (PVA TePla WIN SAM-Vario III)

Scanning Acoustic Microscope
(PVA TePla WIN SAM-Vario III)

 

nordsondagexd7600ntdiamond150x150

2D and 3D (CT-scan) X-Ray Inspection System
(Nordson Dage XD7600NT Diamond FP)

 

De-capsulation

Decapsulated Samples

Decapsulated Samples

 

Decap on specific area

Decap on specific area

 

Copper Wire decap

Copper Wire decap

 

On-board Decap

On-board Decap

 

Package remove–expose backside of Chip

Package remove
– expose backside of Chip

 

Defect Localization

 

Emission Microscope, (EMM)I with Laser Scanning Microscope
(LSM /OBIRCH) (DCG Systems TriVision)

Emission Microscope, (EMMI) with Laser Scanning Microscope (LSM /OBIRCH)
(Thermo Fisher Scientific TriVision) 

 

 

Fault found with EMMI

Fault found with EMMI

 

Thermal Emission (DCG System,s ELITE)

Thermal Emission
(Thermo Fisher Scientific ELITE)

 

Fault found with ELITE

Fault found with ELITE

 

Laser Cutter (EzLaze Laser Cutting System)

Laser Cutter
(EzLaze Laser Cutting System)

 

Layer De-processing

Morphology Imaging

 

 

Image under Hign Power Microscope

Image under High Power Microscope

 

Counting Metal layers

Counting Metal layers

 

Defect under SEM

Defect under SEM

 

Defect under SEM

Defect under SEM

 

Circuit Editing

Focused Ion Beam (DCG Systems OptiFIB -IV) 

Focused Ion Beam
(Thermo Fisher Scientific OptiFIB -IV)

 

Structural Analysis

Cross-section on PCB

Cross-section on PCB

 

 

Cross-section on camera lens

Cross-section on camera lens

 

Materials Analysis

 The IC Failure Analysis Laboratory (ICFAL) also provides laboratory services on materials analysis.

 

Elemental and chemical state analysis

X-ray Photoelectron Spectroscope (XPS)

X-ray Photoelectron Spectroscope (XPS)
(ULVAC-PHI Quantum 2000)

 

Elemental mapping analysis

Field Emission Scanning Electron Microscope

Field Emission Scanning Electron Microscope
(ZEISS GeminiSEM 300 )


Enquiry
+852 2629 6600 / +852 2629 6683
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