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申請資格

申請者需符合以下條件方可申請成為培育公司:

  • 於遞交申請時,申請公司必須為香港註冊不多於兩年的科技公司。香港科技園公司或會要求申請公司提交由核數師審核的財務報告等作證明文件
  • 於遞交申請時,申請公司之創立團隊所持有的公司股份必須多於50%。而創立團隊必須為以個人名義持有股份的股東或非營運性的控股公司 (需提供有關證明文件,如公司組織章程細則)。
  • 申請公司必須有兩位或以上的全職員工於香港合法地工作。其中負責技術範疇的人員或團隊必須持有不少於10%的公司股份 (若有關技術屬大學研究項目並獲有關大學批准,其大學教授所持有的股份亦計算在內)。
  • 申請公司必須有50%或以上的全職員工於香港科學園內工作並參與技術相關的事項。
  • 申請公司需於科技培育中心進行主要研發工作,其辦公室不可只用作銷售和市場推廣用途。
  • 培育中心內不可進行零售或大規模生產。
  • 申請公司於培育中心所設的辦公室或工作枱必須符合環境安全要求,不可處理危險品(生物科技小型企業中心內的培育公司並遵守由香港科技園制訂的安全標準及指引除外)及只可進行辨公大樓許可之工作。
  • 一般於申請公司工作的股東不得現任或曾任為以下公司之股東並現在或曾於其工作:

    (1) 多於兩間其他於同一領域並曾經參加及不成功畢業的培育公司*3; 或
    (2) 同一領域並曾經參加及成功畢業的培育公司*3; 或
    (3) 同一領域並現為培育公司*3。
     
  • 申請公司要求的辦公室面積必須少於1,600 平方呎。
     

備註:
  1. 成功申請的公司,必須於培育期間符合以上的申請資格,並於香港科學園的辦公室內進行核心研發,同時聘有最少兩名全職員工。
  2. 申請公司必須全面申報公司股份持有人的身份及持有狀況。一般而言,若申請公司被另一公司持有股份,該公司不得為一家發展成熟的公司,並從事與申請公司業務相類似的科研工作。
  3. 參與由香港科技園公司,香港數碼港管理有限公司或香港設計中心所營運的培訓計劃。
 

其他質化評估準則

  1. 管理團隊的質素和能力
  2. 有潛力的商業計劃書
  3. 創意
  4. 科研內容
  5. 培育期開始後的每6個月的營運目標 
申請程序
申請程序:
 

第一步:填妥及提交網上申請表,並上傳包括但不限於下列文件:

  • 商業計劃書
  • 履歷表
  • 公司文件(如商業登記、公司註冊證書、AR/NNC1表格。詳情請參閱申請指南。)
 

第二步:香港科技園公司安排面談

第三步:召開評審委員會會議,當中包括計劃演示及問答環節

第四步:審批結果公佈

評審委員會
所有申請會由科技創業培育/生物科技培育計劃的評審申請委員會進行評審。評審委員會包括香港科技園公司高層職員、一至兩位技術諮詢委員會成員,以及一位香港創業及私募投資協會成員。

技術諮詢委員會包括:

•    Prof. Kong Siu-Kai, Department of School of Life Science, The Chinese University of Hong Kong
•    Prof. Chan Ho-Yin Edwin, Department of School of Life Science, The Chinese University of Hong Kong
•    Dr. LI Xuechen, Department of Chemistry, The University of Hong Kong
•    Prof. Aimin Xu, Department of Medicine, The University of Hong Kong
•    Prof. William LU Weijia, Department of Orthopaedics and Traumatology, The University of Hong Kong
•    Prof. Ed WU, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Gang LI, Faculty of Medicine, The Chinese University of Hong Kong
•    Prof. YP ZHENG, Department of Interdisciplinary Division of Biomedical Engineering, Hong Kong Polytechnic University
•    Dr. KH Loo, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Dr. YM Lai, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Michael TSE, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Patrick YUE, Department of Electronic & Computer Engineering, Hong Kong University of Science and Technology
•    Dr. Henry CHAN, Department of Computing, Hong Kong Polytechnic University
•    Prof. Jiannong CAO, Department of Computing, Hong Kong Polytechnic University
•    Prof. LAU Wing Cheong, Department of Information Engineering, The Chinese University of Hong Kong
•    Dr. Eric LO, Department of Computer Science and Engineering, The Chinese University of Hong Kong
•    Prof. Qian ZHANG, Department of Computer Science & Engineering, Hong Kong University of Science and Technology
•    Prof. Qin LU, Department of Computer, Hong Kong Polytechnic University
•    Prof. Joseph NG, Department of Computer Science, Hong Kong Baptist University
•    Dr. K P CHOW, Department of Computer Science, The University of Hong Kong
•    Prof. GQ HUANG, Department of Industrial & Manufacturing Systems Engineering, The University of Hong Kong
•    Prof.. KM LAM, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Lawrence YEUNG, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Kei May LAU, Department of Electronic & Computer Engineering, Hong Kong University of Science and Technology
•    Prof. KW CHEAH, Department of Physics, Hong Kong Baptist University
•    Prof. Ho Ho Pui Aaron, Department of Electronic Engineering, The Chinese University of Hong Kong
•    Prof. Zhao Ni, Department of Electronics Engineering, The Chinese University of Hong Kong
•    Prof. Edmund LAM, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Ning Xi, Department of Industrial & Manufacturing Systems Engineering, The University of Hong Kong
•    Prof. Min WANG, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. KM SHIH, Department of Civil Engineering, The University of Hong Kong
•    Prof. Alfonso Ngan, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. WB LEE, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. KL YUNG, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. Benny CF CHEUNG, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. HY YAM, Department of Electrical Engineering, Hong Kong Polytechnic University
•    Prof. KC CHAN, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. SQ SHI, Department of Mechancial Engineering, Hong Kong Polytechnic University
•    Dr. Wong Ka-Hing, Department of Applied Biology & Chemistry Technology, Hong Kong Polytechnic University
•    Prof. Liao Wei Hsin, Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong
•    Dr. Chunhau Liu, School of Energy and Environment, City University of Hong Kong
•    Prof. Tianshou ZHAO, Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology
•    Prof. Jane LU, Department of Architecture and Civil Engineering, City University of Hong Kong
•    Prof. Qing LI, Department of Computer Science, City University of Hong Kong
•    Dr.. Raymond HS WONG, Department of Computer Science, City University of Hong Kong
•    Prof. Henry Chung, Department of Electronic Engineering, City University of Hong Kong
•    Prof. KT CHAU, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. YG LI, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. Dennis LEUNG, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. TST NG, Department of Civil Engineering, The University of Hong Kong