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申请资格

申请者需符合以下条件方可申请成为培育公司:

  • 於递交申请时,申请公司必须为香港注册不多於两年的科技公司。香港科技园公司或会要求申请公司提交由核数师审核的财务报告等作证明文件
  • 於递交申请时,申请公司之创立团队所持有的公司股份必须多於50%。而创立团队必须为以个人名义持有股份的股东或非营运性的控股公司 (需提供有关证明文件,如公司组织章程细则)。
  • 申请公司必须有两位或以上的全职员工於香港合法地工作。其中负责技术范畴的人员或团队必须持有不少於10%的公司股份 (若有关技术属大学研究项目并获有关大学批准,其大学教授所持有的股份亦计算在内)。
  • 申请公司必须有50%或以上的全职员工於香港科学园内工作并参与技术相关的事项。
  • 申请公司需於科技培育中心进行主要研发工作,其办公室不可只用作销售和市场推广用途。
  • 培育中心内不可进行零售或大规模生产。
  • 申请公司於培育中心所设的办公室或工作枱必须符合环境安全要求,不可处理危险品(生物科技小型企业中心内的培育公司并遵守由香港科技园制订的安全标准及指引除外)及只可进行辨公大楼许可之工作。
  • 一般於申请公司工作的股东不得现任或曾任为以下公司之股东并现在或曾於其工作:

    (1) 多於两间其他於同一领域并曾经参加及不成功毕业的培育公司*3; 或
    (2) 同一领域并曾经参加及成功毕业的培育公司*3; 或
    (3) 同一领域并现为培育公司*3。
  • 申请公司要求的办公室面积必须少於1,600 平方呎。

备注:
  1. 成功申请的公司,必须於培育期间符合以上的申请资格,并於香港科学园的办公室内进行核心研发,同时聘有最少两名全职员工。
  2. 申请公司必须全面申报公司股份持有人的身份及持有状况。一般而言,若申请公司被另一公司持有股份,该公司不得为一家发展成熟的公司,并从事与申请公司业务相类似的科研工作。
  3. 参与由香港科技园公司,香港数码港管理有限公司或香港设计中心所营运的培训计划。

其他质化评估准则

  1. 管理团队的质素和能力
  2. 有潜力的商业计划书
  3. 创意
  4. 科研内容
  5. 培育期开始後的每6个月的营运目标
申请程序
申请程序:
 

第一步:填妥及提交网上申请表,并上传包括但不限於下列文件:

  • 商业计划书
  • 履历表
  • 公司文件(如商业登记丶公司注册证书丶AR/NNC1表格。详情请参阅申请指南。)
 

第二步:香港科技园公司安排面谈

第三步:召开评审委员会会议,当中包括计划演示及问答环节

第四步:审批结果公布

评审委员会
所有申请会由科技创业培育/生物科技培育计划的评审申请委员会进行评审。评审委员会包括香港科技园公司高层职员丶一至两位技术谘询委员会成员,以及一位香港创业及私募投资协会成员。

技术谘询委员会包括:

•    Prof. Kong Siu-Kai, Department of School of Life Science, The Chinese University of Hong Kong
•    Prof. Chan Ho-Yin Edwin, Department of School of Life Science, The Chinese University of Hong Kong
•    Dr. LI Xuechen, Department of Chemistry, The University of Hong Kong
•    Prof. Aimin Xu, Department of Medicine, The University of Hong Kong
•    Prof. William LU Weijia, Department of Orthopaedics and Traumatology, The University of Hong Kong
•    Prof. Ed WU, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Gang LI, Faculty of Medicine, The Chinese University of Hong Kong
•    Prof. YP ZHENG, Department of Interdisciplinary Division of Biomedical Engineering, Hong Kong Polytechnic University
•    Dr. KH Loo, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Dr. YM Lai, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Michael TSE, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Patrick YUE, Department of Electronic & Computer Engineering, Hong Kong University of Science and Technology
•    Dr. Henry CHAN, Department of Computing, Hong Kong Polytechnic University
•    Prof. Jiannong CAO, Department of Computing, Hong Kong Polytechnic University
•    Prof. LAU Wing Cheong, Department of Information Engineering, The Chinese University of Hong Kong
•    Dr. Eric LO, Department of Computer Science and Engineering, The Chinese University of Hong Kong
•    Prof. Qian ZHANG, Department of Computer Science & Engineering, Hong Kong University of Science and Technology
•    Prof. Qin LU, Department of Computer, Hong Kong Polytechnic University
•    Prof. Joseph NG, Department of Computer Science, Hong Kong Baptist University
•    Dr. K P CHOW, Department of Computer Science, The University of Hong Kong
•    Prof. GQ HUANG, Department of Industrial & Manufacturing Systems Engineering, The University of Hong Kong
•    Prof.. KM LAM, Department of Electronic and Information Engineering, Hong Kong Polytechnic University
•    Prof. Lawrence YEUNG, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Kei May LAU, Department of Electronic & Computer Engineering, Hong Kong University of Science and Technology
•    Prof. KW CHEAH, Department of Physics, Hong Kong Baptist University
•    Prof. Ho Ho Pui Aaron, Department of Electronic Engineering, The Chinese University of Hong Kong
•    Prof. Zhao Ni, Department of Electronics Engineering, The Chinese University of Hong Kong
•    Prof. Edmund LAM, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. Ning Xi, Department of Industrial & Manufacturing Systems Engineering, The University of Hong Kong
•    Prof. Min WANG, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. KM SHIH, Department of Civil Engineering, The University of Hong Kong
•    Prof. Alfonso Ngan, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. WB LEE, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. KL YUNG, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. Benny CF CHEUNG, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. HY YAM, Department of Electrical Engineering, Hong Kong Polytechnic University
•    Prof. KC CHAN, Department of Industrial and Systems Engineering, Hong Kong Polytechnic University
•    Prof. SQ SHI, Department of Mechancial Engineering, Hong Kong Polytechnic University
•    Dr. Wong Ka-Hing, Department of Applied Biology & Chemistry Technology, Hong Kong Polytechnic University
•    Prof. Liao Wei Hsin, Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong
•    Dr. Chunhau Liu, School of Energy and Environment, City University of Hong Kong
•    Prof. Tianshou ZHAO, Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology
•    Prof. Jane LU, Department of Architecture and Civil Engineering, City University of Hong Kong
•    Prof. Qing LI, Department of Computer Science, City University of Hong Kong
•    Dr.. Raymond HS WONG, Department of Computer Science, City University of Hong Kong
•    Prof. Henry Chung, Department of Electronic Engineering, City University of Hong Kong
•    Prof. KT CHAU, Department of Electrical & Electronic Engineering, The University of Hong Kong
•    Prof. YG LI, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. Dennis LEUNG, Department of Mechanical Engineering, The University of Hong Kong
•    Prof. TST NG, Department of Civil Engineering, The University of Hong Kong