Reliability Testing
Reliability Testing

The Reliability Laboratory is equipped with advanced test equipment to support product life simulation, environmental room simulation for semiconductor devices and electronic products. Experienced engineers provide reliability tests, reports and product qualification services for customers.  Our services range from temperature-electrical characterisation, dynamic/static burn-in test, temperature cycling test and HAST test.

Reliability Stress Test Service:
  • High Temperature Operating Life Test (HTOL)
  • Low Temperature Operating Life Test (LTOL)
  • Temperature and Humidity Test
  • Temperature and Humidity Bias Test (THB)
  • Reflow Soldering Simulation
  • Temperature Cycle Test (Air-to-Air)
  • Autoclave Test / Pressure Cooker Test
  • Highly Accelerated Stress Test (HAST), Bias or Unbiased
  • High Temperature Storage
  • Moisture Sensitivity Level
  • Moisture Pre-conditioning
Equipment List
Oven/Chamber Manufacturer and Model Application Picture
High Temperature Oven Espec PH-201

Test Application:

  • High Temperature Bake
  • High Temperature Storage Life


Temperature Range:
+20°C to +200°C

Internal Chamber Dimensions:
600(W)x600(H)x600(D) mm

Espec PH-201 High Temperature Oven
High Temperature Oven Espec STPH-201M

Test Application:

  • High Temperature Operating Life


Temperature Range:
+20°C to +500°C

Internal Chamber Dimensions:
600(W)x600(H)x600(D) mm

Espec STPH-201M High Temperature Oven
Bench Top Temperature and Humidity Chamber Espec SH-661 Test Application:
  • Moisture Sensitivity Level
  • Moisture Pre-conditioning
  • Temperature and Humidity Test


Temperature Range:
-60°C to +150°C

Humidity Range:
30%RH to 95%RH

Internal Chamber Dimensions:
400(W)x400(H)x400(D) mm

Espec SH-661 Bench Top Temperature and Humidity Chamber
Temperature and Humidity Chamber Espec PL-1KP

Test Application:

  • Moisture Sensitivity Level
  • Moisture Pre-conditioning
  • Temperature and Humidity Test


Temperature Range:
-40°C to +100°C

Humidity Range:
20%RH to 98%RH

Internal Chamber Dimensions:
500(W)x600(H)x400(D) mm

Espec PL-1KP Temperature and Humidity Chamber
Temperature and Humidity Chamber Feutron 3436/16/S400 Test Application:
  • Temperature and Humidity Test


Temperature Range:
-75°C to +180°C

Humidity Range:
< 5%RH to > 98%RH

Internal Chamber Dimensions:
720(W)x690(H)x560(D) mm

Feutron 3436/16/S400 Temperature and Humidity Chamber
Temperature and Humidity Chamber Memmert HCP
108 W4

Test Application:

  • Temperature and Humidity Test


Temperature Range:
20°C to 160°C

Humidity Range:
20%RH to 95%RH

Internal Chamber Dimensions:
560(W)x480(H)x400(D) mm

Memmert HCP 108 W4
Temperature, Humidity and Pressure Chamber Temperature and Humidity Chamber Espec EHS-411MD

Test Application:

  • Autoclave/HAST (Bias or Unbiased)


Temperature Range:
+105°C to 162.2°C

Humidity Range:
75%RH to 100%RH

Pressure Range:
2.9 to 56.8 PSI (gauge)

Internal Chamber Dimensions:
255(W)x255(H)x318(D) mm

Espec EHS-411MD Temperature, Humidity and Pressure Chamber Temperature and Humidity Chamber
Temperature, Humidity and Pressure Chamber Espec EHS-221MD Test Application:
  • HAST (Bias or Unbiased) / Autoclave


Temperature Range:
+105°C to 142.9°C

Humidity Range:
75%RH to 100%RH

Pressure Range:
2.9 to 28.4 PSI (gauge)

Internal Chamber Dimensions:
355(W)x355(H)x426(D) mm

Espec EHS-221MD Temperature, Humidity and Pressure Chamber
Thermal Shock Chamber Espec TSE-11A Test Application:
  • Temperature Cycle / Thermal Shock (Air to Air)

 

Temperature Range:
Low: -65°C to 0°C
High: +60°C to +200°C

Internal Chamber Dimensions:
320(W)x148(H)x230(D) mm

Maximum Load Capacity:
3 kg

Recovery Time:
Within 5 minutes with 2kg IC from -65°C to +150°C / +150°C to -65°C

Espec TSE-11A Thermal Shock Chamber
Solder Reflow System Heller 1809EXLN

Test Application:

  • SMD Soldering Simulation


Temperature Range:
+25°C to +350°C
(Sn/Pb & Pb Free Capable)

Heated Tunnel Length:
254cm

Number of Heating Zone:
9 Top and 9 Bottom

Number of Cooling Zone:
2 Top and 2 Bottom

Reflow Atmosphere:
Air / Nitrogen Ready

Heller 1809EXLN Solder Reflow System
Burn-In Test System EDA DA-24

Test Application:

  • High Temperature Operating Life (HTOL)
  • Low Temperature Operating Life (LTOL)


Temperature Range:
-50 °C to +150°C

Device Type Applicable:
Digital, Microprocessor, Memory, Analog / Mixed Device

Internal Chamber Dimensions:
580(W) x 520(H) x 570(D) mm

Burn-in Board Capacity:
24 BIB's

Number of I/O Lines:
256 per Module x6 Module

Pattern Generator:
128 Channels @ 25 Mhz, 8M (depth)

Driver Board Output Current:
125 mA to 250 mA

Device Power Supply:
+1~+5Vdc, -3~-16.5Vdc, +4.8~+52.0Vdc

EDA DA-24 Burn-In Test System
Fast Rate Temperature
Humidity Chamber
Votsch VCS 7048-15

Test Application:

  • PCB Board Level


Temperature Range:
-70°C to + 180°C

Temperature Ramp-Up Rate:
17°C/minute

Temperature Ramp-Down Rate:
15°C/minute

Humidity Range:
10% RH to 95% RH

Internal Dimension:
800 (W) x 920(H) x 650 (D) mm

Votsch VCS 7048-15 Fast Rate Temperature Humidity Chamber