IC Failure Analysis
The IC Failure Analysis Laboratory (ICFAL) is equipped with advanced test equipment to support the product analysis for semiconductor devices and electronic products.

Experienced engineers provide complete IC failure analysis flow including:

 
  • Verify Failure Mode
  • Electrical Testing
  • External Package Inspection
  • Internal Package Inspection
  • De-capsulation
  • Defect Location
  • Layer De-processing
  • Optical Microscopy
  • Scanning Electron Microscopy
  • Circuit Editing
  • Structural Analysis
Equipment List
Verify Failure Mode   Electrical Testing
Curve Tracer (Tektronix 370B) Parametric Analyzer (HP 4155A) ESD (HBM/MM) & Latch-up Tester (Thermo KeyTek ZapMaster MK 2)
Curve Tracer
(Tektronix 370B)
Parametric Analyzer
(HP 4155A)

ESD (HBM/MM) & Latch-up Tester
(Thermo KeyTek ZapMaster MK 2)

 
External and Internal Package Inspection 
Stereo Microscope
(Leica S6D) Scanning Acoustic Microscope (PVA TePla WIN SAM-Vario III)
Stereo Microscope
(Leica S6D)
Scanning Acoustic Microscope
(PVA TePla WIN SAM-Vario III)
2D and 3D (CT-scan) X-Ray Inspection System (Nordson Dage XD7600NT Diamond FP)
 
De-capsulation
Laser Decapsulation System (Nisene) Decapsulated Samples Decap on specific area
Laser Decapsulation System
(Nisene)
Decapsulated Samples Decap on specific area
Copper Wire decap On-board Decap Package remove–expose backside of Chip
Copper Wire decap On-board Decap Package remove
–expose backside of Chip
 
Defect Locate
Emission Microscope, (EMM)I with Laser Scanning Microscope
(LSM /OBIRCH) (DCG Systems TriVision) Fault found with EMMI Thermal Emission (DCG System,s ELITE)
Emission Microscope, (EMM)I with Laser Scanning Microscope
(LSM /OBIRCH) (DCG Systems TriVision)

Fault found with EMMI
Thermal Emission
(DCG System,s ELITE)
Fault found with ELITE Laser Cutter (EzLaze Laser Cutting System) Manual Probe Station (Karl Suss PM-8)
Fault found with ELITE Laser Cutter
(EzLaze Laser Cutting System)
Manual Probe Station
(Karl Suss PM-8)
 
Layer De-processing
Reactive Ion Etching (RIE) systems (Oxford Instruments,, Plasmalab 80+) Layer deprocessing  
Reactive Ion Etching (RIE) systems
(Oxford Instruments,, Plasmalab 80+)
Layer deprocessing  
 
Optical Microscopy, SEM
High Magnification Microscope (Leica DM8000M) Image under Hign Power Microscope Counting Metal layers
High Magnification Microscope
(Leica DM8000M)
Image under Hign Power Microscope Counting Metal layers
Field Emission Scanning Electron Microscope (FEI Nova NanoSEM  600) Defect under SEM Defect under SEM
Field Emission Scanning Electron Microscope
(FEI Nova NanoSEM  600)
Defect under SEM Defect under SEM
 
Circuit Editing Structural Analysis  
Focused Ion Beam (DCG Systems OptiFIB -IV) Cross-section on PCB Cross-section on camera lens
Focused Ion Beam
(DCG Systems OptiFIB -IV)
Cross-section on PCB Cross-section on camera lens