IC Failure Analysis



The IC Failure Analysis Laboratory (ICFAL) provides laboratory services with advanced test equipment to support the product analysis for semiconductor devices and electronic products.


Experienced engineers provide complete IC failure analysis flow including:

  • Failure Mode Verification
  • Electrical Testing
  • External Package Inspection
  • Internal Package Inspection
  • De-capsulation
  • Defect Localization
  • Layer De-processing
  • Optical Microscopy
  • Scanning Electron Microscopy
  • Circuit Editing
  • Structural Analysis

Laboratory Services - Equipment List

Verify Failure Mode

Curve Tracer (Tektronix 370B)

Curve Tracer
(Tektronix 370B)

Electrical Testing

ESD (HBM/MM) & Latch-up Tester (Thermo Fisher Scientific MK.2 ESD and Latch-Up Test System)

ESD (HBM/MM) & Latch-up Tester
(Thermo Fisher Scientific MK.2 ESD and Latch-Up Test System)

External and Internal Package Inspection

Stereo Microscope (Leica S6D)

Stereo Microscope
(Leica S6D)

Scanning Acoustic Microscope (PVA TePla WIN SAM-Vario III)

Scanning Acoustic Microscope
(PVA TePla WIN SAM-Vario III)

2D and 3D (CT-scan) X-Ray Inspection System (Nordson Dage XD7600NT Diamond FP)

2D and 3D (CT-scan) X-Ray Inspection System
(Nordson Dage XD7600NT Diamond FP)

De-capsulation

Laser Decapsulation System (Nisene)

Laser Decapsulation System
(Nisene)

Decapsulated Samples

Decapsulated Samples

Decap on specific area

Decap on specific area

Copper Wire decap

Copper Wire decap

On-board Decap

On-board Decap

Package remove – expose backside of Chip

Package remove
– expose backside of Chip

Defect Localization

Emission Microscope, (EMMI) with Laser Scanning Microscope (LSM /OBIRCH) (Thermo Fisher Scientific TriVision)

Emission Microscope, (EMMI) with Laser Scanning Microscope (LSM /OBIRCH)
(Thermo Fisher Scientific TriVision) 

Fault found with EMMI

Fault found with EMMI

Thermal Emission (Thermo Fisher Scientific ELITE)

Thermal Emission
(Thermo Fisher Scientific ELITE)

Fault found with ELITE

Fault found with ELITE

Laser Cutter (EzLaze Laser Cutting System)

Laser Cutter
(EzLaze Laser Cutting System)

Manual Probe Station (FormFactor PM-8)

Manual Probe Station
(FormFactor PM-8)

Layer De-processing

Reactive Ion Etching (RIE) systems (Oxford Instruments, Plasmalab 80+)

Reactive Ion Etching (RIE) systems
(Oxford Instruments, Plasmalab 80+)

Layer deprocessing

Layer deprocessing

Morphology Imaging

High Magnification Microscope (Leica DM8000M)

High Magnification Microscope
(Leica DM8000M)

Image under High Power Microscope

Image under High Power Microscope

Counting Metal layers

Counting Metal layers

Field Emission Scanning Electron Microscope (ZEISS GeminiSEM 300 )

Field Emission Scanning Electron Microscope
(ZEISS GeminiSEM 300 )

Defect under SEM

Defect under SEM

Defect under SEM

Defect under SEM

Circuit Editing

Focused Ion Beam (Thermo Fisher Scientific OptiFIB -IV)

Focused Ion Beam
(Thermo Fisher Scientific OptiFIB -IV)

Structural Analysis

Cross-section on PCB

Cross-section on PCB

Cross-section on camera lens

Cross-section on camera lens

Materials Analysis

The IC Failure Analysis Laboratory (ICFAL) also provides laboratory services on materials analysis.

Elemental mapping analysis

Field Emission Scanning Electron Microscope (ZEISS GeminiSEM 300 )

Field Emission Scanning Electron Microscope
(ZEISS GeminiSEM 300 )

Enquiry

Telephone number: +852 2629 6600

Email address: pal@hkstp.org

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