Introduction
IC Design Centre
- Introduction
- EDA Centre
- Data Centre
- Design Engineering Offices
- Intellectual Property (IP) Servicing Centre
- IC Training Centre
- Multi-Project Wafer Services
- Enquiry & Booking Form
IC Development Support Centre
- Introduction
- Probe and Test Development Centre
- Test Development Service
- Reliability Tests Service
- Engineering Sample Test Service
- Qualification Processing Service
- Characterization Test Service
- Wafer Probe Service
- Low Volume Production Test Service
- IC Product Analysis Service
- Enquiry & Booking Form
Photonics Centre
- Introduction
- Photonics Development Support Centre
- Solid State Lighting Laboratory
- Enquiry & Booking Form
Material Analysis Laboratory
- Introduction
- Enquiry & Booking Form
Life Science Building
- Introduction
- Building Features
- Shared Equipment Laboratory
- Support for biotechnology start-up companies
- Enquiry & Booking Form
Wireless Centre
- Introduction
- 3GPP Testing Services
- Digital Video Broadcasting Testing Services
- Wireless Technologies Testing Services
- Enquiry & Booking Form

Photonics Centre
Introduction


Designed to provide multidisciplinary laboratory facilities and equipment supporting research and development of optical fibre data communication devices, panel displays, light-emitting devices and optoelectronic sensors, the Photonics Centre is one of the most vital infrastructures for companies engaging in photonics product development in Hong Kong.

In the fibre optics bitcom and datacom areas, the Centre is equipped with a full range of sophisticated test and measurement equipment encompassing the latest technological advances, including RF shieldrooms, micro-optics benches and various test stations for time-resolved chirp, optical dispersion, polarisation, and bit error rate test and characterisation. For visible wavelength displays, solid state lighting, and optoelectronic sensor devices, the Centre supports product performance test and verification.

The Centre also provides other supporting services including technical training, product qualification and prototype assembly, which includes fibre polishing, die cutting, flip-chip bonding and wire bonding for electrical connections


 
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