Oven/Chamber |
Model |
Application |
High Temperature
Oven
|
Espec
PH-201
 |
Test Application:
- High Temperature Bake
- High Temperature Storage Life
Temperature Range:
+20°C to +200°C
Internal Chamber Dimensions:
600(W)x600(H)x600(D) mm |
Ultra High
Temperature Oven
|
Espec
STPH-201M
 |
Test Application:
- High Temperature Operating Life
Temperature Range:
+20°C to +500°C
Internal Chamber Dimensions:
600(W)x600(H)x600(D) mm |
Bench Top
Temperature and
Humidity Chamber
|
Espec
SH-661
 |
Test Application:
- Moisture Sensitivity Level
- Moisture Pre-conditioning
- Temperature and Humidity Test
Temperature Range:
-60°C to +150°C
Humidity Range:
30%RH to 95%RH
Internal Chamber Dimensions:
400(W)x400(H)x400(D) mm |
Temperature and
Humidity Chamber
|
Espec
PL-1KP
 |
Test Application:
- Moisture Sensitivity Level
- Moisture Pre-conditioning
- Temperature and Humidity Test
Temperature Range:
-40°C to +100°C
Humidity Range:
20%RH to 98%RH
Internal Chamber Dimensions:
500(W)x600(H)x400(D) mm |
Temperature and
Humidity Chamber
with UV or
Sunlight Simulation
|
Feutron
3436/16/S400
 |
Test Application:
- Climatic Test with UV or Sunlight Simulation
Temperature Range:
-75°C to +180°C
Humidity Range:
< 5%RH to > 98%RH
Wavelength Coverage:
- With Filter D75: Terrestrial Sunlight 340~750nm
- With Filter AMO: Extra-terrestrial Sunlight
Transmitted Energy:
* UVSPOT 400:
- Radiated Power: 30mW/cm 2 in a distance of 20cm, 5mW/cm 2 in a distance of 50cm
* SOL500:
- Radiated Power: 600W/m 2 in a distance of 20cm, 220W/m 2 in a distance of 50cm
Internal Chamber Dimensions:
720(W)x690(H)x560(D) mm |
Temperature, Humidity
and Pressure Chamber
|
Espec
EHS-411MD
 |
Test Application:
- Autoclave/HAST (Bias or Unbiased)
Temperature Range:
+105°C to 162.2°C
Humidity Range:
75%RH to 100%RH
Pressure Range:
2.9 to 56.8 PSI (gauge)
Internal Chamber Dimensions:
255(W)x255(H)x318(D) mm |
Temperature, Humidity
and Pressure Chamber
|
Espec
EHS-221MD
 |
Test Application:
- HAST (Bias or Unbiased) / Autoclave
Temperature Range:
+105°C to 142.9°C
Humidity Range:
75%RH to 100%RH
Pressure Range:
2.9 to 28.4 PSI (gauge)
Internal Chamber Dimensions:
355(W)x355(H)x426(D) mm |
Thermal Shock Chamber
|
Espec
TSE-11A
 |
Test Application:
- Temperature Cycle / Thermal Shock (Air to Air)
Temperature Range:
Low: -65°C to 0°C
High: +60°C to +200°C
Internal Chamber Dimensions:
320(W)x148(H)x230(D) mm
Maximum Load Capacity:
8 kg
Recovery Time:
Within 5 minutes with 2kg IC from -65°C to +150°C / +150°C to -65°C |
Solder Reflow System
|
Heller
1809EXLN
 |
Test Application:
- SMD Soldering Simulation
Temperature Range:
+25°C to +350°C
(Sn/Pb & Pb Free Capable)
Heated Tunnel Length:
254cm
Number of Heating Zone:
9 Top and 9 Bottom
Number of Cooling Zone:
2 Top and 2 Bottom
Reflow Atmosphere:
Air / Nitrogen Ready |
Burn-In Test System
|
EDA
DA-24
 |
Test Application:
- High Temperature Operating Life (HTOL)
- Low Temperature Operating Life (LTOL)
Temperature Range:
-50 °C to +150°C
Device Type Applicable:
Digital, Microprocessor, Memory, Analog / Mixed Device
Internal Chamber Dimensions:
580(W) x 520(H) x 570(D) mm
Internal Chamber Environment:
Air, N2 Injectable (Dual Chamber)
Burn-in Board Capacity:
24 BIB's
Number of I/O Lines:
256 per Module x6 Module
Pattern Generator:
128 Channels @ 25 Mhz, 8M (depth)
Driver Board Output Current:
125 mA to 250 mA
Device Power Supply:
+1~+5Vdc, -3~-16.5Vdc, +4.8~+52.0Vdc |
FAST RATE CHAMBER
- Model No.: VCS 7048-15
- Manufacturer: Votsch
- No. of unit available: 1 (by 3Q07) |
 |
Temperature Range:
-70oC to + 180oC
Temperature Heat-Up Rate
17oC/minute
Temperature Pull-Down Rate
15oC/minute
Humidity Range:
10% to 95% RH |
